Microstructure Observation, Accumulated Equivalent Stress, and Creep Strain Simulation of SPD Disconnector Solder Joint Based on Isothermal Aging

التفاصيل البيبلوغرافية
العنوان:	Microstructure Observation, Accumulated Equivalent Stress, and Creep Strain Simulation of SPD Disconnector Solder Joint Based on Isothermal Aging
المؤلفون:	Zhou, Q., Cao, T., Liu, Y., Huang, X., Bian, X.
المصدر:	IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(11):1771-1780 Nov, 2022
قاعدة البيانات:	IEEE Xplore Digital Library

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