التفاصيل البيبلوغرافية
| العنوان: |
Transient thermal management of SiC power modules by an in-built thermal buffer layer |
| المؤلفون: |
Tang, Weiyu, Li, Junye, Lu, Junliang, Wu, Zan, Sheng, Kuang |
| المصدر: |
2022 IEEE Transportation Electrification Conference and Expo, Asia-Pacific (ITEC Asia-Pacific) Transportation Electrification Conference and Expo, Asia-Pacific (ITEC Asia-Pacific), 2022 IEEE. :1-4 Oct, 2022 |
| Relation: |
2022 IEEE Transportation Electrification Conference and Expo, Asia-Pacific (ITEC Asia-Pacific) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
