Ceramic Additive Manufacturing Potential for Power Electronics Packaging

التفاصيل البيبلوغرافية
العنوان:	Ceramic Additive Manufacturing Potential for Power Electronics Packaging
المؤلفون:	Akbari, S., Kostov, K., Brinkfeldt, K., Adolfsson, E., Lim, J., Andersson, D., Bakowski, M., Wang, Q., Salter, M.
المصدر:	IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(11):1857-1866 Nov, 2022
قاعدة البيانات:	IEEE Xplore Digital Library

كن أول من يترك تعليقا!