دورية أكاديمية
High-Temperature Encapsulation Materials for Power Modules: Technology and Future Development Trends
| العنوان: | High-Temperature Encapsulation Materials for Power Modules: Technology and Future Development Trends |
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| المؤلفون: | Gao, H., Liu, P. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(11):1867-1881 Nov, 2022 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2022.3225960 |