دورية أكاديمية
Toward near-bulk resistivity of Cu for next-generation nano-interconnects: Graphene-coated Cu
| العنوان: | Toward near-bulk resistivity of Cu for next-generation nano-interconnects: Graphene-coated Cu |
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| المؤلفون: | Lee, Hyo Chan, Jo, Mankyu, Lim, Hyungsub, Yoo, Min Seok, Lee, Eunho, Nguyen, Nguyen Ngan, Han, Sang Youn, Cho, Kilwon |
| المصدر: | In Carbon August 2019 149:656-663 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 00086223 |
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| DOI: | 10.1016/j.carbon.2019.04.101 |