دورية أكاديمية
Adhesion experiments on Cu-Damascene processed interconnect structures for mode III loading
العنوان: | Adhesion experiments on Cu-Damascene processed interconnect structures for mode III loading |
---|---|
المؤلفون: | Heyn, W., Melzner, H., Goller, K., Ananiev, S., Zechner, J., Clausner, A., Zschech, E. |
المصدر: | In Microelectronics Reliability September 2023 148 |
قاعدة البيانات: | ScienceDirect |
تدمد: | 00262714 |
---|---|
DOI: | 10.1016/j.microrel.2023.115161 |