دورية أكاديمية
Adhesion experiments on Cu-Damascene processed interconnect structures for mode III loading
| العنوان: | Adhesion experiments on Cu-Damascene processed interconnect structures for mode III loading |
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| المؤلفون: | Heyn, W., Melzner, H., Goller, K., Ananiev, S., Zechner, J., Clausner, A., Zschech, E. |
| المصدر: | In Microelectronics Reliability September 2023 148 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 00262714 |
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| DOI: | 10.1016/j.microrel.2023.115161 |