التفاصيل البيبلوغرافية
| العنوان: |
Adhesive-free bonding for hetero-integration of InP based coupons micro-transfer printed on SiO2 into Complementary Metal-Oxide-Semiconductor backend for Si photonics application on 8″ wafer platform |
| المؤلفون: |
Anand, K., Steglich, P., Kreissl, J., Chavarin, C.A., Spirito, D., Franck, M., Lecci, G., Costina, I., Herfurth, N., Katzer, J., Mai, C., Becker, A., Reithmaier, J.P., Zimmermann, L., Mai, A. |
| المصدر: |
In Thin Solid Films 30 June 2024 799 |
| قاعدة البيانات: |
ScienceDirect |
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