دورية أكاديمية
Enhanced adhesion strength between electroplated Cu and ABF substrate with isothermal annealing treatment
| العنوان: | Enhanced adhesion strength between electroplated Cu and ABF substrate with isothermal annealing treatment |
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| المؤلفون: | Hsu, Pei-Chia, Chang, Shun-Cheng, Lu, Wen-Xuan, Liu, Hung-Cheng, Ho, Cheng-En |
| المصدر: | In Surface & Coatings Technology 15 March 2024 479 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 02578972 |
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| DOI: | 10.1016/j.surfcoat.2024.130576 |