دورية أكاديمية
Compressible thermal interface materials with high through-plane thermal conductivity from vertically oriented carbon fibers
العنوان: | Compressible thermal interface materials with high through-plane thermal conductivity from vertically oriented carbon fibers |
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المؤلفون: | Fu, Liqin, Kong, Nizao, Huang, Min, Tian, Yexin, Yan, Yuanwei, Wen, Bingjie, Ye, Chong, Huang, Dong, Han, Fei |
المصدر: | In Journal of Alloys and Compounds 5 June 2024 987 |
قاعدة البيانات: | ScienceDirect |
تدمد: | 09258388 |
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DOI: | 10.1016/j.jallcom.2024.174200 |