دورية أكاديمية
Spatial arrangements and types of dislocations in interfacial networks obtained by Si(001) wafer bonding at low twist angle: A TEM characterization
| العنوان: | Spatial arrangements and types of dislocations in interfacial networks obtained by Si(001) wafer bonding at low twist angle: A TEM characterization |
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| المؤلفون: | Patout, L., Alfonso, C., Descoins, M., Fournel, F., Mangelinck, D., Mangelinck-Noël, N. |
| المصدر: | In Materials Science in Semiconductor Processing December 2024 184 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 13698001 |
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| DOI: | 10.1016/j.mssp.2024.108814 |