دورية أكاديمية
Flip-chip solder bumps defect detection using a self-search lightweight framework
| العنوان: | Flip-chip solder bumps defect detection using a self-search lightweight framework |
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| المؤلفون: | Sun, Yu, Su, Lei, Gu, Jiefei, Zhao, Xinwei, Li, Ke, Pecht, Michael |
| المصدر: | In Advanced Engineering Informatics April 2024 60 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 14740346 |
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| DOI: | 10.1016/j.aei.2024.102395 |