مورد إلكتروني

Failure behavior and failure criterion of conductive cracks (deep notches) in piezoelectric ceramics I - the charge-free zone model

التفاصيل البيبلوغرافية
العنوان: Failure behavior and failure criterion of conductive cracks (deep notches) in piezoelectric ceramics I - the charge-free zone model
المؤلفون: Zhang, TY, Zhao, MH, Liu, GN
بيانات النشر: 2004
نوع الوثيقة: Electronic Resource
مستخلص: The charge-free zone model proposed by Zhang et al. for the failure of conductive cracks in dielectrics was extended to predict the failure behavior of conductive cracks in piezoelectric ceramics. Piezoelectric ceramics were treated as mechanically brittle and electrically ductile materials in the charge-free zone model. The failure criterion, developed from the charge-free zone model, for conductive cracks in piezoelectric ceramics under mechanical and/or electrical loading has ail elliptic shape in terms of the normalized electric intensity factor and the normalized stress intensity factor. The experimental results reported in Part II of the series verified the theoretical predictions. (C) 2004 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
مصطلحات الفهرس: Fracture and fracture toughness, Electroceramics, Conductive crack, Theory and modeling, Article
URL: http://repository.ust.hk/ir/Record/1783.1-30836
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=1359-6454&rft.volume=52&rft.issue=7&rft.date=2004&rft.spage=2013&rft.epage=2024&rft.aulast=Zhang&rft.aufirst=TY&rft.atitle=Failure+behavior+and+failure+criterion+of+conductive+cracks+(deep+notches)+in+piezoelectric+ceramics+I+-+the+charge-free+zone+model
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000221001300024
http://www.scopus.com/record/display.url?eid=2-s2.0-1842502631&origin=inward
الإتاحة: Open access content. Open access content
ملاحظة: English
أرقام أخرى: HNK oai:repository.ust.hk:1783.1-30836
Acta materialia, v. 52, (7), 2004, APR, p. 2013-2024
1359-6454
https://doi.org/10.1016/j.actamat.2003.12.014
895578536
المصدر المساهم: HONG KONG UNIV OF SCI & TECH, THE
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رقم الأكسشن: edsoai.ocn895578536
قاعدة البيانات: OAIster