مؤتمر
The EUI instrument on board the Solar Orbiter mission: from breadboard and prototypes to instrument model validation
العنوان: | The EUI instrument on board the Solar Orbiter mission: from breadboard and prototypes to instrument model validation |
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المؤلفون: | Halain, Jean-Philippe, Rochus, Pierre, Renotte, Etienne, Appourchaux, T., Berghmans, D., Harra, L., Schühle, U., Schmutz, W., Auchère, F., Zhukov, A., Dumesnil, C., Delmotte, F., Kennedy, T., Mercier, R., Pfiffner, D., Rossi, Laurence, Tandy, J., BenMoussa, A., Smith, Phillip |
المصدر: | Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series (2012-06); SPIE 8443, Space Telescopes and Instrumentation 2012: Ultraviolet to Gamma Ray, Juin 2012 |
سنة النشر: | 2012 |
مصطلحات موضوعية: | Extreme Ultraviolet Imager, Solar Orbiter, breadboard, prototype, instrument design, model philosophy, thermo-mechanical test, AIT, Engineering, computing & technology, Aerospace & aeronautics engineering, Ingénierie, informatique & technologie, Ingénierie aérospatiale |
الوصف: | The Solar Orbiter mission will explore the connection between the Sun and its heliosphere, taking advantage of an orbit approaching the Sun at 0.28 AU. As part of this mission, the Extreme Ultraviolet Imager (EUI) will provide full-sun and high-resolution image sequences of the solar atmosphere at selected spectral emission lines in the extreme and vacuum ultraviolet.To achieve the required scientific performances under the challenging constraints of the Solar Orbiter mission it was required to further develop existing technologies. As part of this development, and of its maturation of technology readiness, a set of breadboard and prototypes of critical subsystems have thus been realized to improve the overall instrument design. The EUI instrument architecture, its major components and sub-systems are described with their driving constraints and the expected performances based on the breadboard and prototype results. The instrument verification and qualification plan will also be discussed. We present the thermal and mechanical model validation, the instrument test campaign with the structural-thermal model (STM), followed by the other instrument models in advance of the flight instrument manufacturing and AIT campaign. |
نوع الوثيقة: | conference paper http://purl.org/coar/resource_type/c_5794 conferenceObject |
اللغة: | English |
DOI: | 10.1117/12.924343 |
URL الوصول: | https://orbi.uliege.be/handle/2268/200508 |
حقوق: | open access http://purl.org/coar/access_right/c_abf2 info:eu-repo/semantics/openAccess |
رقم الأكسشن: | edsorb.200508 |
قاعدة البيانات: | ORBi |
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