دورية أكاديمية
Encapsulated carbon nanotube array as a thermal interface material compatible with standard electronics packaging
| العنوان: | Encapsulated carbon nanotube array as a thermal interface material compatible with standard electronics packaging |
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| المؤلفون: | Bai, Ruixiang, Wei, Yangbing, Xu, Jiyuan, Li, Xiaobo, Li, Menglin, Zou, Ziwen, Huang, Xinyan, Liu, Chengyu, Sun, YiweiAff2, IDs122740235872y_cor9, Hao, MenglongAff1, IDs122740235872y_cor10 |
| المصدر: | Nano Research. 16(8):11389-11400 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 19980124 19980000 |
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| DOI: | 10.1007/s12274-023-5872-y |