دورية أكاديمية
Promoted grain refinement in tool-chip interface during ultrasonic elliptical vibration-assisted cutting of polycrystalline copper
| العنوان: | Promoted grain refinement in tool-chip interface during ultrasonic elliptical vibration-assisted cutting of polycrystalline copper |
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| المؤلفون: | Zhang, Wenxin, Zhang, JunjieAff1, IDs0017002414341w_cor2, Wang, ZhanfengAff2, IDs0017002414341w_cor3 |
| المصدر: | The International Journal of Advanced Manufacturing Technology. :1-12 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 02683768 14333015 |
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| DOI: | 10.1007/s00170-024-14341-w |