دورية أكاديمية
Unraveling Adsorption Behaviors of Levelers for Bottom-Up Copper Filling in Through-Silicon-Via
| العنوان: | Unraveling Adsorption Behaviors of Levelers for Bottom-Up Copper Filling in Through-Silicon-Via |
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| المؤلفون: | Jin, SangHoonAff1, Aff2, Kim, Sung-MinAff1, IDs13391022003646_cor2, Jo, YugeunAff1, Aff2, Lee, Woon Young, Lee, Sang-YulAff2, IDs13391022003646_cor5, Lee, Min HyungAff1, IDs13391022003646_cor6 |
| المصدر: | Electronic Materials Letters. 18(6):583-591 |
| قاعدة البيانات: | Springer Nature Journals |
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