دورية أكاديمية
Creep Behaviour of Aluminium 7075 Feedstock Billet Globular Microstructure at High Processing Temperature
| العنوان: | Creep Behaviour of Aluminium 7075 Feedstock Billet Globular Microstructure at High Processing Temperature |
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| المؤلفون: | Megalingam, A., Ahmad, A. H.Aff1, Aff2, IDs11668024019177_cor2, Alang, N. A., Alias, J., Naher, S. |
| المصدر: | Journal of Failure Analysis and Prevention. 24(3):1324-1332 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 15477029 18641245 |
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| DOI: | 10.1007/s11668-024-01917-7 |