دورية أكاديمية
Exploring mechanism of suppressing void formation at Interface of Sn–9Zn and Cu
| العنوان: | Exploring mechanism of suppressing void formation at Interface of Sn–9Zn and Cu |
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| المؤلفون: | Shen, Yu-AnAff1, IDs10854024125589_cor1, Lin, Chan-Ying, Chen, Chih-MingAff2, IDs10854024125589_cor3 |
| المصدر: | Journal of Materials Science: Materials in Electronics. 35(11) |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 09574522 1573482X |
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| DOI: | 10.1007/s10854-024-12558-9 |