دورية أكاديمية
Interface characteristics of different bonded structures fabricated by low-temperature a-Ge wafer bonding and the application of wafer-bonded Ge/Si photoelectric device
| العنوان: | Interface characteristics of different bonded structures fabricated by low-temperature a-Ge wafer bonding and the application of wafer-bonded Ge/Si photoelectric device |
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| المؤلفون: | Ke, Shaoying, Ye, Yujie, Wu, Jinyong, Ruan, Yujiao, Zhang, Xiaoying, Huang, Wei, Wang, Jianyuan, Xu, Jianfang, Li, Cheng, Chen, SongyanAff1 |
| المصدر: | Journal of Materials Science: Full Set - Includes `Journal of Materials Science Letters'. 54(3):2406-2416 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 00222461 15734803 |
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| DOI: | 10.1007/s10853-018-3015-8 |