المؤلفون: |
Das S; Department of Materials Science and Engineering, University of California, Berkeley, CA, USA. sujitdas@berkeley.edu.; Department of Physics, University of California, Berkeley, CA, USA. sujitdas@berkeley.edu., Hong Z; Department of Materials Science and Engineering, The Pennsylvania State University, University Park, PA, USA.; Department of Mechanical Engineering, Carnegie Mellon University, Pittsburgh, PA, USA., Stoica VA; Department of Materials Science and Engineering, The Pennsylvania State University, University Park, PA, USA., Gonçalves MAP; Materials Research and Technology Department, Luxembourg Institute of Science and Technology (LIST), Esch/Alzette, Luxemburg.; Departamento de Ciencias de la Tierra y Física de la Materia Condensada, Universidad de Cantabria, Cantabria Campus Internacional, Santander, Spain.; Physics and Materials Science Research Unit, University of Luxembourg, Belvaux, Luxembourg., Shao YT; School of Applied and Engineering Physics, Cornell University, Ithaca, NY, USA., Parsonnet E; Department of Physics, University of California, Berkeley, CA, USA., Marksz EJ; National Institute of Standards and Technology, Boulder, CO, USA., Saremi S; Department of Materials Science and Engineering, University of California, Berkeley, CA, USA., McCarter MR; Department of Physics, University of California, Berkeley, CA, USA., Reynoso A; Department of Physics, University of California, Berkeley, CA, USA., Long CJ; National Institute of Standards and Technology, Boulder, CO, USA., Hagerstrom AM; National Institute of Standards and Technology, Boulder, CO, USA., Meyers D; Department of Materials Science and Engineering, University of California, Berkeley, CA, USA., Ravi V; Department of Materials Science and Engineering, University of California, Berkeley, CA, USA., Prasad B; Department of Materials Science and Engineering, University of California, Berkeley, CA, USA., Zhou H; Advanced Photon Source, Argonne National Laboratory, Argonne, IL, USA., Zhang Z; Advanced Photon Source, Argonne National Laboratory, Argonne, IL, USA., Wen H; Advanced Photon Source, Argonne National Laboratory, Argonne, IL, USA., Gómez-Ortiz F; Departamento de Ciencias de la Tierra y Física de la Materia Condensada, Universidad de Cantabria, Cantabria Campus Internacional, Santander, Spain., García-Fernández P; Departamento de Ciencias de la Tierra y Física de la Materia Condensada, Universidad de Cantabria, Cantabria Campus Internacional, Santander, Spain., Bokor J; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, USA., Íñiguez J; Materials Research and Technology Department, Luxembourg Institute of Science and Technology (LIST), Esch/Alzette, Luxemburg.; Physics and Materials Science Research Unit, University of Luxembourg, Belvaux, Luxembourg., Freeland JW; Advanced Photon Source, Argonne National Laboratory, Argonne, IL, USA., Orloff ND; National Institute of Standards and Technology, Boulder, CO, USA., Junquera J; Departamento de Ciencias de la Tierra y Física de la Materia Condensada, Universidad de Cantabria, Cantabria Campus Internacional, Santander, Spain., Chen LQ; Department of Materials Science and Engineering, The Pennsylvania State University, University Park, PA, USA., Salahuddin S; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, USA., Muller DA; School of Applied and Engineering Physics, Cornell University, Ithaca, NY, USA.; Kavli Institute at Cornell for Nanoscale Science, Ithaca, NY, USA., Martin LW; Department of Materials Science and Engineering, University of California, Berkeley, CA, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, USA., Ramesh R; Department of Materials Science and Engineering, University of California, Berkeley, CA, USA. rramesh@berkeley.edu.; Department of Physics, University of California, Berkeley, CA, USA. rramesh@berkeley.edu.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, USA. rramesh@berkeley.edu. |