مؤتمر
Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging.
| العنوان: | Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging. |
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| المؤلفون: | Wei-Lan Chiu, Lu, Chia-Ling, Lin, Han-Wen, Liu, Chien-Min, Huang, Yi-Sa, Tien-Lin Lu, Liu, Tao-Chi, Hsiao, Hsiang-Yao, Chen, Chih, Kuo, Jui-Chao, Tu, King-Ning |
| المصدر: | 2015 International Conference on Electronic Packaging & iMAPS All Asia Conference (ICEP-IAAC); 2015, p518-522, 5p |
| قاعدة البيانات: | Complementary Index |
Full Text Finder | ردمك: | 9784904090138 |
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| DOI: | 10.1109/ICEP-IAAC.2015.7111069 |