التفاصيل البيبلوغرافية
| العنوان: |
In-situ synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stress evolution during Sn whisker/hillock formation. |
| المؤلفون: |
Fei Pei, Jadhav, Nitin, Buchovecky, Eric, Bower, Allan F., Chason, Eric, Wenjun Liu, Tischler, Jonathan Z., Ice, Gene E., Ruqing Xu |
| المصدر: |
Journal of Applied Physics; 2016, Vol. 119 Issue 10, p1-11, 11p, 1 Diagram, 6 Graphs |
| مصطلحات موضوعية: |
TIN research, ELECTRIC properties, COPPER, X-ray detection, DEVIATORIC stress (Engineering) |
| مستخلص: |
We have performed X-ray synchrotron micro-diffraction measurements to study the processes controlling the formation of hillocks and whiskers in Sn layers on Cu. The studies were done in real-time on Sn layers that were electro-deposited immediately before the X-ray measurements were started. This enabled a region of the sample to be monitored from the as-deposited state until after a hillock feature formed. In addition to measuring the grain orientation and deviatoric strain (via Laue diffraction), the X-ray fluorescence was monitored to quantify the evolution of the Sn surface morphology and the formation of intermetallic compound (IMC) at the Sn-Cu interface. The results capture the simultaneous growth of the feature and the corresponding film stress, grain orientation, and IMC formation. The observations are compared with proposed mechanisms for whisker/hillock growth and nucleation. [ABSTRACT FROM AUTHOR] |
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| قاعدة البيانات: |
Complementary Index |
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