التفاصيل البيبلوغرافية
| العنوان: |
Evaluation of High Thermal Conductivity - Sintered Hybrid Die-Attach Materials in High-Power Electronic Packaging and Interconnections: A Comprehensive Review. |
| المؤلفون: |
Saleh, Syaidah Md, Salim, Mohd Azli, Masripan, Nor Azmmi, Saad, Adzni Md., Feng Dai, Photong, Chonlatee, Wahid, Ameeruz Kamal Ab |
| المصدر: |
International Journal of Nanoelectronics & Materials; 2022 Special Issue, Vol. 15, p467-482, 16p |
| مصطلحات موضوعية: |
ELECTRONIC packaging, COLLOIDAL silver, THERMAL conductivity, PACKAGING materials, ELECTRONIC materials, MANUFACTURING processes, MATERIALS testing |
| مستخلص: |
In recent times, high-temperature applications are quite essential. However, most of the pure conductive materials that are currently available in the market are incapable of achieving high thermal conductivity. As a result, numerous researchers have investigated and tested a proper material process. Research on developing composite material such as hybrid silver with different particle sizes, silver/copper, silver/graphene, and copper/graphene are intensively discovered. Colloidal silver (silver organic) provides the highest thermal conductivity (229 W/m K) followed by hybrid graphene/copper material e.g., 168.5 W/m K. As the hybrid graphene/copper shows the positive impact in thermal conductivity, hybrid graphene/silver with two different sizes of silver particles has become an attractive option to be investigated. Thermal conductivity outcomes higher than 250 W/m K are expected to be developed. [ABSTRACT FROM AUTHOR] |
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| قاعدة البيانات: |
Complementary Index |
