التفاصيل البيبلوغرافية
| العنوان: |
金刚石微粉低温化学镀镍品质影响因素. (Chinese) |
| Alternate Title: |
Influencing Factors of Electroless Nickel Plating of Diamond Micro-Powders at Low Temperature. (English) |
| المؤلفون: |
方莉俐, 李靖华, 刘 韩 |
| المصدر: |
Journal of Synthetic Crystals; Aug2022, Vol. 51 Issue 8, p1459-1465, 7p |
| مصطلحات موضوعية: |
ELECTROLESS deposition, NICKEL-plating, PLATING baths, ELECTROLESS plating, TEMPERATURE effect, LOW temperatures |
| Abstract (English): |
The influence of complexing agent, solution pH value and temperature on the quality of electroless nickel plating of diamond powder at low temperature were investigated. At the temperature of 35 t and the pH value of 5, the stability of plating solution, deposition rate, morphology and phosphorus (P) content of electroless nickel plating coating were tested and analyzed by changing the ratio of complexing agent. The results show that CeHgO, • H2O (20 g/L) + (CH2)2(COOH)2(5 g/L) is the best complexing agent in test samples. The electroless plating solution corresponding to the complexing agent has good stability and rapid deposition rate (0. 391 5 g/h), and the obtained coating is leak-free and dense, with P weight content of 11. 73%. The deposition rate, morphology and P content of electroless plating samples were measured and analyzed by changing pH value and temperature of plating solution with the best complexing agent. The results show that when the temperature of the plating bath is 35 t and the pH value is 3 ~13, the deposition rate increases and the P content gradually decrease with the increase of the pH value. When the pH value is higher than 11, the rapid reaction rate is difficult to stabilize the pH value of the plating solution, and the plating solution is easy to decompose, so the pH value is more suitable within 5 - 11. The effect of temperature on plating was studied in the range of 30 - 50 t at solution pH value of 5. It is found that the deposition rate and P content increase with the increase of temperature, and the plating layer is dense and leak-free. When the temperature is higher than 45 t, the reaction rate is too fast and it is not easy to stabilize the pH value of the plating solution, so the temperature is more appropriate in the range from 35 t to 45 C. [ABSTRACT FROM AUTHOR] |
| Abstract (Chinese): |
研究络合剂、镀液pH值、温度对金刚石微粉低温化学镀镍品质的影响。在温度为35 t、pH值为5时, 通过改变 络合剂配比, 对镀液稳定性,镀层沉积速率、形貌和磷(P)含量进行测试分析。结果表明,20 g/L的柠檬酸+5 g/L的 琥珀酸为本文最优的络合剂配比,其化学镀液稳定性好、沉积速率较快(0. 391 5 g/h),镀层致密无漏镀,P含量为 11. 73% (质量分数)。用最优络合剂, 通过改变镀液pH值、温度, 对化学镀样品的镀层沉积速率、形貌、P含量进行测 试分析。结果表明, 镀液温度为35t,pH值为3 ~13时, 随着pH值增大, 沉积速率逐渐增大,P含量逐渐减小。但 pH值高于11时, 反应速率过快,不易稳定镀液pH值,且镀液易分解, 因此pH值在5 ~11较为合适。在镀液pH值为 5,温度为30~50 t时,随着温度升高, 沉积速率和P含量都随之增高, 镀层致密无漏镀。但温度高于45忙时,反应速 率过快, 不易稳定镀液pH值, 因此温度在35 ~45 t较为合适. [ABSTRACT FROM AUTHOR] |
|
Copyright of Journal of Synthetic Crystals is the property of Journal of Synthetic Crystals Editorial Office and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) |
| قاعدة البيانات: |
Complementary Index |
