التفاصيل البيبلوغرافية
| العنوان: |
P‐5.4: The Improvement of Wet Stripping Residuals in Cu Process. |
| المؤلفون: |
He, Jia-Wei, Chung, Smart, Liao, Peter, Zheng, Hui-Long, Su, Zi-Fang, Zhang, Xiang, Jia, Yu-Bin |
| المصدر: |
SID Symposium Digest of Technical Papers; Oct2022 Supplement S1, Vol. 53, p781-784, 4p |
| مصطلحات موضوعية: |
ELECTRICAL resistivity, ELECTRODIFFUSION, ALUMINUM, COPPER, INDIUM gallium zinc oxide, COPPER films, PIXELS |
| مستخلص: |
Copper conductor has lower electrical resistivity (approximately) 2μ͉·;cm) and higher electromigration resistance than aluminum conductor, so it is applied to TFT to solve the undercharge of pixel electrode resulted from aluminum conductor. However there are filiform residuals generated through stripping in the copper process, and more serious than aluminum process. In this paper, we verified through a series of experiments that the quality improvement of clean water of stripping can improve the filiform residuals. [ABSTRACT FROM AUTHOR] |
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| قاعدة البيانات: |
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