دورية أكاديمية

Influence of the Process Parameters on the Properties of Cu-Cu Ultrasonic Welds.

التفاصيل البيبلوغرافية
العنوان: Influence of the Process Parameters on the Properties of Cu-Cu Ultrasonic Welds.
المؤلفون: Faes, Koen, Nunes, Rafael, De Meester, Sylvia, De Waele, Wim, Rubino, Felice, Carlone, Pierpaolo
المصدر: Journal of Manufacturing & Materials Processing; Feb2023, Vol. 7 Issue 1, p19, 18p
مصطلحات موضوعية: ULTRASONIC welding, JOINING processes, INTERNAL friction, FREQUENCIES of oscillating systems, WELDED joints, WELDING, COPPER
مستخلص: Ultrasonic welding (USW) is a solid-state welding process based on the application of high frequency vibration energy to the workpiece to produce the internal friction between the faying surface and the local heat generation required to promote the joining. The short welding time and the low heat input, the absence of fumes, sparks or flames, and the automation capacity make it particularly interesting for several fields, such as electrical/electronic, automotive, aerospace, appliance, and medical products industries. The main problems that those industries have to face are related to the poor weld quality due the improper selection of weld parameters. In the present work, 0.3 mm thick copper sheets were joined by USW varying the welding time, pressure, and vibration amplitude. The influence of the process variables on the characteristics of the joints and weld strength is investigated by using the analysis of variance. The results of the present work indicate that welding time is the main factor affecting the energy absorbed during the welding, followed by the pressure and amplitude. The shear strength, on the other hand, resulted mostly influenced by the amplitude, while the other parameters have a limited effect. Regardless the welding configuration adopted, most welds registered a failure load higher than the base material pointing out the feasibility of the USW process to join copper sheets. [ABSTRACT FROM AUTHOR]
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قاعدة البيانات: Complementary Index
الوصف
تدمد:25044494
DOI:10.3390/jmmp7010019