دورية أكاديمية

Numerical study optimation design of CPU cooling system analysis using CFD method.

التفاصيل البيبلوغرافية
العنوان: Numerical study optimation design of CPU cooling system analysis using CFD method.
المؤلفون: Yudanto, Fajar Dwi, Inderanata, Rochmad Novian, Johan, Arif Bintoro, Setuju
المصدر: Applied Engineering & Technology; Dec2023, Vol. 2 Issue 3, p241-253, 13p
مصطلحات موضوعية: SYSTEM analysis, COMPUTATIONAL fluid dynamics, TAGUCHI methods, COPPER, COMPUTER circuits, CENTRAL processing units
مستخلص: Electronic devices such as integrated circuits and computer microprocessors are made of various components that generate high heat (increased temperature and thermal fluctuations cause thermal stress), which is the main cause of failure of electronic devices, thus requiring cooling. Component placement is frequently utilized to improve the CPU room conditions to keep it cool. This research numerically investigates desktop PC processors and heatsink configurations for mechanical engineering vocational learning. The kind of metal material, number of fans, and fan arrangement were all tested at three levels. The computer components in this research are the CPU, heatsink, fan, and processor—a 65-watt Thermal Design Power (TDP) CPU with a constant air intake speed of 5 m/s. The criteria investigated include metal type (steel, aluminum, and copper), cooling design (horizontal, vertical, and mixed), and fan count (2-4-8). The methods used in this research are the Computational Fluid Dynamics (CFD) method and the Taguchi method to examine fluid flow characteristics and temperature. Numerical results show the maximum temperature is 123 °C in the vertical, eight-fan, and steel configurations. Minimum temperature 39.22 °C in mixed configuration, eight fans, and copper. These findings reveal that the kind of metal material, number of fans, and fan arrangement all impact the CPU cooler and heatsink configuration. However, the Taguchi method can provide a more detailed understanding of configuration. [ABSTRACT FROM AUTHOR]
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قاعدة البيانات: Complementary Index
الوصف
تدمد:28294998
DOI:10.31763/aet.v2i3.1207