التفاصيل البيبلوغرافية
| العنوان: |
Effect of sleeve temperature in sleeve soldering on the solder melting process and pressure fluctuation inside the sleeve. |
| المؤلفون: |
Nakamichi, Keita, Fukuoka, Hiroshi, Suda, Atsushi, Uwano, Hidetake |
| المصدر: |
AIP Conference Proceedings; 2024, Vol. 3086 Issue 1, p1-7, 7p |
| مصطلحات موضوعية: |
SLEEVES, TEMPERATURE effect, SOLDER & soldering, MELTING, PRINTED circuits, SOLDER pastes |
| مستخلص: |
Sleeve soldering is useful for high-current and high-voltage circuit manufacturing because it enables high-quality soldering. Sleeve soldering is one of the point soldering methods. In sleeve soldering, a solder piece that falls into a heated cylindrical sleeve and melts to join a pin to a printed circuit board (PCB). The purpose of this study is to investigate the effect of the sleeve temperature in sleeve soldering on the solder melting process and the pressure fluctuations inside the sleeve. The parameter of the experiment is the sleeve temperature. We observe the physical shape change of the solder piece during the melting process with a high-speed camera. We also measured a pressure change synchronously to investigate the pressure fluctuation inside the sleeve due to the shape change of the solder piece. As a result, the timing of solder melting became slower as the sleeve temperature decreased. The pressure waveform in the sleeve differs with changes in the timing of solder melting. A difference appears in the timing of the solder piece melting and the timing of the sleeve ascending. In most cases, the pressure of good solder after the sleeve ascends is lower than that of a bad solder. This suggests that the pressure after the sleeve ascends effectively detects soldering defects. [ABSTRACT FROM AUTHOR] |
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