التفاصيل البيبلوغرافية
| العنوان: |
Experimental and numerical studies of the effect of perforation configuration on heat transfer enhancement of pin fins heat sink. |
| المؤلفون: |
Alpha, Ndah Abdulrahman, Aondover, Iortyer Humphrey, Kuhe, Aondoyila |
| المصدر: |
Heat Transfer; Jul2024, Vol. 53 Issue 5, p2525-2555, 31p |
| مصطلحات موضوعية: |
HEAT transfer, HEAT sinks, HEAT convection, FORCED convection, NUSSELT number, FINS (Engineering), VORTEX generators |
| مستخلص: |
In this study, experimental and computational studies of the impact of forced convective flow on the heat transfer characteristics of staggered pin fins with perforations are investigated in a rectangular channel at constant heat flux with Reynolds numbers (Re) of 2 × 103–12 × 103. In particular, cylindrical pin fins with circular longitudinal (L) perforation, longitudinal/transverse (LT) perforation, and longitudinal/transverse/vertical (LTV) perforation perforations are compared to solid pin fins to find out how adding different perforation arrays affects overall heat transfer performance and also to find the best perforation configuration for maximum performance. ANSYS‐FLUENT is employed for numerical simulation, validated by experimental data. Experimental validation is conducted by attaching the heat sink to a Peltier module, inducing heat generation through current on one face in the Armfield Free and Forced Convection Heat Transfer Service Units HT 19 and HT10XC. Results highlight significant increases in Nusselt number (Nu) for perforated pins compared to solid pins, with L perforations at 8%, LT perforations at 33%, and 67% for LTV perforated pins due to transverse perforations that act as slots, which stir up the primary flow and induce secondary flow generated by vertical perforations. Regarding pressure drops, L perforations reduce by 9%, LT by 19%, and LTV by 27% compared to solid pins. The overall enhancement ratio peaks at the minimum Reynold number, notably achieving a 38% increase in the LTV perforation pin fin array. This innovative study holds promise for diverse electronic applications, offering enhanced heat transfer performance in electronic cooling systems. [ABSTRACT FROM AUTHOR] |
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| قاعدة البيانات: |
Complementary Index |
