مؤتمر
Low-k/copper integration scheme suitable for ULSI manufacturing from 90nm to 45nm nodes.
| العنوان: | Low-k/copper integration scheme suitable for ULSI manufacturing from 90nm to 45nm nodes. |
|---|---|
| المؤلفون: | Nogami, T., Lane, S., Fukasawa, M., Ida, K., Angyal, M., Chanda, K., Chen, F., Christiansen, C., Cohen, S., Cullinan, M., Dziobkowski, C., Fitzsimmons, J., Flaitz, P., Grill, A., Gill, J., Inoue, K., Klymko, N., Kumar, K., Labelle, C., Lane, M. |
| المصدر: | Proceedings of SPIE; Nov2005 Part 2, Issue 1, p60020L-60020L-15, 15p |
| قاعدة البيانات: | Complementary Index |
| تدمد: | 0277786X |
|---|---|
| DOI: | 10.1117/12.633066 |