مؤتمر
Electromigration Failure Mechanism and Lifetime Expectation for Bi-Modal Distribution in Cu/Low-k Interconnect.
| العنوان: | Electromigration Failure Mechanism and Lifetime Expectation for Bi-Modal Distribution in Cu/Low-k Interconnect. |
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| المؤلفون: | Young Jin Wee, Kim, A.T., Jung Eun Lee, Jae Yeol Maeng, Woon Hyuk Choi, Seowoo Nam, Seungjin Lee, Kyoung Woo Lee, Jaehak Kim, Keeyoung Jun, Seung Man Choi, Jaeouk Choo, Jungshik Heo, Hong Jae Shin, Nae In Lee |
| المصدر: | 2007 IEEE International Interconnect Technology Conference; 2007, p31-33, 3p |
| قاعدة البيانات: | Complementary Index |
Full Text Finder | ردمك: | 9781424410699 |
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| DOI: | 10.1109/IITC.2007.382343 |