مؤتمر
Via Interconnections for Wafer Level Packaging: Impact of Tapered Via Shape and Via Geometry on Product Yield and Reliability.
| العنوان: | Via Interconnections for Wafer Level Packaging: Impact of Tapered Via Shape and Via Geometry on Product Yield and Reliability. |
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| المؤلفون: | Shariff, D., Suthiwongsunthorn, N., Bieck, F., Leib, J. |
| المصدر: | 2007 Proceedings 57th Electronic Components & Technology Conference; 2007, p858-863, 6p |
| قاعدة البيانات: | Complementary Index |
Full Text Finder | ردمك: | 9781424409853 |
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| DOI: | 10.1109/ECTC.2007.373899 |