مؤتمر
Process and Reliability of Copper Column Flexible Flip Chip Connection (F2C2).
| العنوان: | Process and Reliability of Copper Column Flexible Flip Chip Connection (F2C2). |
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| المؤلفون: | Ta-Hsuan Lin, Andros, F., Lu, S., Sammakia, B. |
| المصدر: | 2008 10th Electronics Packaging Technology Conference; 2008, p1316-1320, 5p |
| قاعدة البيانات: | Complementary Index |
Full Text Finder | ردمك: | 9781424421176 |
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| DOI: | 10.1109/EPTC.2008.4763613 |