مؤتمر
Enhancing the mechanical reliability of miniaturized thermoelectric cooler using nanotechnology underfill.
| العنوان: | Enhancing the mechanical reliability of miniaturized thermoelectric cooler using nanotechnology underfill. |
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| المؤلفون: | Xingrui Chen, Teng Wang, Nurnus, J., Benkendorf, M., Liu, J. |
| المصدر: | 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP); 2010, p1250-1254, 5p |
| قاعدة البيانات: | Complementary Index |
Full Text Finder | ردمك: | 9781424481408 |
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| DOI: | 10.1109/ICEPT.2010.5582779 |