مؤتمر
Integration of carrierless ultrathin wafers into a TSV process flow.
| العنوان: | Integration of carrierless ultrathin wafers into a TSV process flow. |
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| المؤلفون: | Bieck, F., Spiller, S., Molina, F., To?pper, M., Lopper, C., Kuna, I., Fischer, T., Roder, J., Dietrich, L., Tabuchi, T. |
| المصدر: | 2010 12th Electronics Packaging Technology Conference (EPTC); 2010, p571-575, 5p |
| قاعدة البيانات: | Complementary Index |
Full Text Finder | ردمك: | 9781424485604 |
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| DOI: | 10.1109/EPTC.2010.5702703 |