مؤتمر
On mold corner effects of EMC adhesion for IC encapsulation process.
| العنوان: | On mold corner effects of EMC adhesion for IC encapsulation process. |
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| المؤلفون: | Chia-Hsun Yeh, Chen-hung Deng, Huei-Huang Lee, Sheng-Jye Hwang, Durn-Yuan Huang |
| المصدر: | Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), 2011 6th International; 2011, p280-283, 4p |
| قاعدة البيانات: | Complementary Index |
Full Text Finder | ردمك: | 9781457713873 |
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| DOI: | 10.1109/IMPACT.2011.6117263 |