مؤتمر
Robust spin-on glass gap-fill process technology for sub-30nm interlayer dielectrics.
| العنوان: | Robust spin-on glass gap-fill process technology for sub-30nm interlayer dielectrics. |
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| المؤلفون: | Kyung-Mun Byun, Deok-Young Jung, Jun-Won Lee, Seungheon Lee, Hyongsoo Kim, Mun-Jun Kim, Eunkee Hong, Mansug Gang, Seok-Woo Nam, Joo-Tae Moon, Chilhee Chung, Jung-Hoo Lee, Hyo-Sug Lee |
| المصدر: | Interconnect Technology Conference (IITC), 2010 International; 2010, p1-3, 3p |
| قاعدة البيانات: | Complementary Index |
Full Text Finder | ردمك: | 9781424476763 |
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| DOI: | 10.1109/IITC.2010.5510709 |