دورية أكاديمية

A Study of Stress-Induced p[sup +]/n Salicided Junction Leakage Failure and Optimized Process Conditions for Sub-0.15-µm CMOS Technology.

التفاصيل البيبلوغرافية
العنوان: A Study of Stress-Induced p[sup +]/n Salicided Junction Leakage Failure and Optimized Process Conditions for Sub-0.15-µm CMOS Technology.
المؤلفون: Joo-Hyoung Lee, Sung-Hyung Park, Key-Min Lee, Ki-Seok Youn, Young-Jin Park, Chel-Jong Choi, Tae-Yeon Seong, Hi-Deok Lee
المصدر: IEEE Transactions on Electron Devices; Nov2002, Vol. 49 Issue 11, p1985, 8p, 11 Black and White Photographs, 2 Diagrams, 15 Graphs
مصطلحات موضوعية: COMPLEMENTARY metal oxide semiconductors, SEMICONDUCTOR junctions
مستخلص: Clarifies that mechanical stress combined with shallower junction at the active edge is the main cause of junction leakage current failure of shallow p[sup +]/n salicided junctions for sub-0.15 micrometer complementary metal oxide semiconductors technology. Finding that the application of a shallow trench isolation (STI), top corner rounding process suppresses the mechanical stress of STI top corner.
قاعدة البيانات: Complementary Index
الوصف
تدمد:00189383
DOI:10.1109/TED.2002.804704