دورية أكاديمية

Research on simulation and experimental of thermal performance of LED array heat sink.

التفاصيل البيبلوغرافية
العنوان: Research on simulation and experimental of thermal performance of LED array heat sink.
المؤلفون: Wengang, Hao, Lulu, Wei, Zongmin, Zhang, Yanhua, Lai, Mingxin, Lv
المصدر: Procedia Engineering; 2017, Vol. 205, p2084-2091, 8p
مصطلحات موضوعية: HEAT sinks, HEATING, COOLING, THERMAL management (Electronic packaging), HEATING & ventilation industry
مستخلص: This study presents experimental study and numerical simulation on thermal analysis and design of array heat sink under natural convection conditions. Based on computational fluid dynamics (CFD) method, the thermal performances of LED array heat sink have been studied. The numerical results show that both the average convection heat transfer coefficient and the heat resistance decrease with the increase of the number of fins. The heights of the fins have the same effect on LED array thermal performance with the number of fins. The heating power and horizontal air inlet volumes can lead to the decrease of the thermal resistance and the increase of the average convection heat transfer coefficient. And according to the regression analysis method, the average Nusselt criterion correlations were derived. Furthermore, the numerical results are also compared to the experimental dates, this study suggest that the established mathematical models can be predicted the heat transfer characteristics of this type heat sink. [ABSTRACT FROM AUTHOR]
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قاعدة البيانات: Supplemental Index
الوصف
تدمد:18777058
DOI:10.1016/j.proeng.2017.10.102