دورية
Failure analysis of integrated devices by scanning thermal microscopy (SThM)
| العنوان: | Failure analysis of integrated devices by scanning thermal microscopy (SThM) |
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| المؤلفون: | Fiege, G. B. M., Feige, V., Phang, J. C. H., Maywald, M., Goerlich, S., Balk, L. J. |
| المصدر: | Microelectronics Reliability; 1998, Vol. 38 Issue: 6 p957-962, 6p |
| قاعدة البيانات: | Supplemental Index |
Full Text Finder | تدمد: | 00262714 |
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| DOI: | 10.1016/S0026-2714(98)00086-9 |