دورية
Resist Removal Process in Dual Damascene Structure Integrating Cu and SiLK for 0.18 mm Technology
| العنوان: | Resist Removal Process in Dual Damascene Structure Integrating Cu and SiLK for 0.18 mm Technology |
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| المؤلفون: | Louis, D., Arvet, C., Lajoinie, E., Peyne, C., Lee, S., Berry, I., Han, Q. |
| المصدر: | Microelectronic Engineering; 2000, Vol. 53 Issue: 1 p381-384, 4p |
| قاعدة البيانات: | Supplemental Index |
Full Text Finder | تدمد: | 01679317 |
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| DOI: | 10.1016/S0167-9317(00)00338-5 |