دورية
Efficient validation testing of Through-Silicon-Via (TSV) ASICs for CZT x-ray detectors
| العنوان: | Efficient validation testing of Through-Silicon-Via (TSV) ASICs for CZT x-ray detectors |
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| المؤلفون: | Payne, Stephen A., James, Ralph B., Burger, Arnold, Fiederle, Michael, Violette, Daniel, Allen, Branden, Hong, Jae Sub, Basak, Arkadip, Grindlay, Jonathan |
| المصدر: | Proceedings of SPIE; September 2018, Vol. 10762 Issue: 1 p107620S-107620S-7, 968588p |
| قاعدة البيانات: | Supplemental Index |
| تدمد: | 0277786X |
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| DOI: | 10.1117/12.2321694 |