Wet Chemical Etching Behavior of Ga(Al)As and In(Ga)P(As) Layers

التفاصيل البيبلوغرافية
العنوان: Wet Chemical Etching Behavior of Ga(Al)As and In(Ga)P(As) Layers
المؤلفون: Franz, Gerhard, Charlotte Hoyler, Charlotte Hoyler, Dagmar Sacher, Dagmar Sacher
المصدر: Japanese Journal of Applied Physics; November 1991, Vol. 30 Issue: 11 p2693-2693, 1p
مستخلص: The chemical etching behavior of Ga(Al)As and In(Ga)P(As) containing sandwich layers grown by metalorganic vapor phase epitaxy has been investigated using various etching solutions. The chemical background is described by a potential-pH diagram. Activation energies obtained were between 0.28 and 0.46 eV. The inclination angle of the etched walls is mainly 55°. In both the systems, a transition from a reaction-rate limited process to a diffusion-rate-limited one is observed. In InP, a reactive intermediate with an inclination angle of 45° could be trapped.
قاعدة البيانات: Supplemental Index
الوصف
تدمد:00214922
13474065
DOI:10.1143/JJAP.30.2693