دورية
(Invited) Low Temperature Direct Bonding 3D Stacking Technologies for High Density Device Integration
| العنوان: | (Invited) Low Temperature Direct Bonding 3D Stacking Technologies for High Density Device Integration |
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| المؤلفون: | Di Cioccio, Lea, Radu, Ionut, Gaudin, Gweltaz, Lacave, Thomas, Baudin, Floriane, Sadaka, Mariam, Signamarcheix, Thomas |
| المصدر: | ECS Transactions; August 2013, Vol. 58 Issue: 9 |
| مستخلص: | 3D integration aims at providing highly integrated systems by vertically stacking and connecting various materials, technologies, and functional components together. We will review the different approaches, using direct bonding, developed to address 3D devices manufacturing challenges. |
| قاعدة البيانات: | Supplemental Index |
| تدمد: | 19385862 19386737 |
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| DOI: | 10.1149/05809.0017ecst |