دورية
The potential of wire electron beam additive manufacturing of copper
| العنوان: | The potential of wire electron beam additive manufacturing of copper |
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| المؤلفون: | Zamorano Reichold, A., Baufeld, B. |
| المصدر: | Progress in Additive Manufacturing; 20240101, Issue: Preprints p1-7, 7p |
| مستخلص: | Copper presents a number of challenges for additive manufacturing. These include high thermal conductivity, significant light reflectivity, and sever oxide formation. The electron beam as an energy source can overcome these difficulties in the production of copper AM components due to the high power available, the high process energy efficiency, and the fact that the process takes place in vacuum. Non-porous copper components can be produced at high deposition rates of up to 2.5 kg/h using wire electron beam additive manufacturing. This technique can also create multi-material components in both copper and steel, and copper features on copper components. It should be emphasized that an average power of 3.0 kW was sufficient to produce copper features on copper components at the high deposition rate mentioned above. The power and energy distribution of the electron beam can be adjusted at any time. This allows grain growth and the associated microstructure to be influenced. It has been found that using a copper base plate instead of a steel base plate requires significantly different process parameters. Successfully producing geometries on copper base plates is challenging due to the high thermal conductivity of copper and requires a large beam power in the early layers. Pure copper components made by wire electron beam additive manufacturing have an electrical conductivity of 100% of the international standard for annealed copper. By optimizing the energy input and distribution, the ultimate tensile strength of 206 MPa with a strain at failure of 31% can be achieved. |
| قاعدة البيانات: | Supplemental Index |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 23639512 23639520 |
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| DOI: | 10.1007/s40964-023-00488-7 |