Modifying the Microstructure and Mechanical Properties of Non-Heat Treated HPDC AlSi10MnMg Foundry Alloy via Incorporation of TiB2 Particles and Sc

التفاصيل البيبلوغرافية
العنوان: Modifying the Microstructure and Mechanical Properties of Non-Heat Treated HPDC AlSi10MnMg Foundry Alloy via Incorporation of TiB2 Particles and Sc
المؤلفون: Shareef, Nisha, Liu, Xiang Ting, Zhao, Kai, Shahzad, Muhammad Saqib, Zhang, Jing Tao, Guo, En Yu, Kang, Hui Jun, Hao, Zhi Gang, Li, Jie Hua, Wang, Cun Shan, Chen, Zong Ning, Wang, Tong Min
المصدر: Key Engineering Materials; May 2024, Vol. 981 Issue: 1 p107-122, 16p
مستخلص: The demand for structural lightweight in a variety of industries, particularly the automobile industry, has driven the development of heat-free die-cast aluminum alloys with excellent properties. Utilizing lightweight materials, such as Al-Si alloys has several benefits, including higher overall performance in automobiles and other industries, increased heat resistance efficiency, decreased emissions, and reduced weight. The purpose of this study is to modify the microstructure and enhance the mechanical properties of high-pressure die-casting (HPDC) AlSi10MnMg foundry alloy by incorporation of TiB2 and Sc without any heat treatment. The results showed that the HPDC process significantly refines the grain structure and AlSiMnFe intermetallic compounds, transforming the eutectic morphology from sharp to rounded, and 93% enhancement in elongation at the optimum content (0.018 wt.%) of TiB2. While the hardness of the alloy was improved by 15.7% with the addition of 0.03wt.% TiB2. TiB2 incorporation refines the grain structure and AlSiMnFe phases, while depressing externally solidified crystals (ESCs). The HPDC process refines Al3Sc phases as well as AlSiMnFe phases while increasing yield strength due to Al3Sc strengthening effects. After 0.5wt.% Sc addition in 0.018wt.% TiB2-AlSi10MnMg alloy, the YS, and EL reached the maximum of 196MPa and 9.93% respectively.
قاعدة البيانات: Supplemental Index
الوصف
تدمد:10139826
16629795
DOI:10.4028/p-Dsd17k