AlN wideband energy harvesters with wafer-level vacuum packaging utilizing three-wafer bonding

التفاصيل البيبلوغرافية
العنوان: AlN wideband energy harvesters with wafer-level vacuum packaging utilizing three-wafer bonding
المؤلفون: Li Yan Siow, Peter Hyun Kee Chang, Yuandong Gu, Chengliang Sun, Qingxin Zhang, Hongmiao Ji, Nan Wang
المصدر: 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS).
بيانات النشر: IEEE, 2017.
سنة النشر: 2017
مصطلحات موضوعية: 010302 applied physics, Materials science, Wafer bonding, business.industry, 010401 analytical chemistry, Electrical engineering, 01 natural sciences, Top cap, 0104 chemical sciences, Getter, 0103 physical sciences, Optoelectronics, Wafer, Vacuum level, Wideband, business, Power density, Voltage
الوصف: This paper experimentally demonstrates an aluminum nitride (AlN) based piezoelectric MEMS energy harvester (EH) with an operation bandwidth of 64.6Hz (859.9Hz–924.5Hz, 7.24%), peak output open-circuit voltage of 4.43V, and an output power of 82.24μW that yields a high power density of 0.734mW/cm3 with its size of 0.8×0.8×0.175cm3. The in-house microfabricated wideband EH is packaged using a novel wafer-level vacuum packaging scheme which employs two times of eutectic AlGe bonding to bond the device wafer to both the top cap wafer and the bottom cap wafer. In addition, Ti is employed as the getter material to enhance the vacuum level inside the cavity, hence reducing the air damping experienced by the cantilevers and increasing the quality factor (Q-factor) and output voltage. The reported EH is a promising candidate in the application of Internet of Things (IoT) to for powering various wireless sensor nodes (WSN) which are located in environment with a wide range of vibration frequencies.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0057bcfc6d541c6262b0c981ea2c4638
https://doi.org/10.1109/memsys.2017.7863539
رقم الأكسشن: edsair.doi...........0057bcfc6d541c6262b0c981ea2c4638
قاعدة البيانات: OpenAIRE