Fabrication of Highly (111)-oriented Nanotwinned Cu in Fine-pitch Vias for Cu/SiO2 Hybrid Bonding
| العنوان: | Fabrication of Highly (111)-oriented Nanotwinned Cu in Fine-pitch Vias for Cu/SiO2 Hybrid Bonding |
|---|---|
| المؤلفون: | Shih-Chi Yang, Jia-Juen Ong., Dinh-Phuc Tran, Wei-Lan Chiu, Ou-Hsing Lee, Chia-Wen Chiang, Hsiang-Hung Chang, Chin-Hung Wang, Chih Chen |
| المصدر: | 2023 International Conference on Electronics Packaging (ICEP). |
| بيانات النشر: | IEEE, 2023. |
| سنة النشر: | 2023 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::006b89dc32a9b277cf53d110fb93b01b https://doi.org/10.23919/icep58572.2023.10129678 |
| حقوق: | CLOSED |
| رقم الأكسشن: | edsair.doi...........006b89dc32a9b277cf53d110fb93b01b |
| قاعدة البيانات: | OpenAIRE |
| الوصف غير متاح. |