Fabrication of Highly (111)-oriented Nanotwinned Cu in Fine-pitch Vias for Cu/SiO2 Hybrid Bonding
العنوان: | Fabrication of Highly (111)-oriented Nanotwinned Cu in Fine-pitch Vias for Cu/SiO2 Hybrid Bonding |
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المؤلفون: | Shih-Chi Yang, Jia-Juen Ong., Dinh-Phuc Tran, Wei-Lan Chiu, Ou-Hsing Lee, Chia-Wen Chiang, Hsiang-Hung Chang, Chin-Hung Wang, Chih Chen |
المصدر: | 2023 International Conference on Electronics Packaging (ICEP). |
بيانات النشر: | IEEE, 2023. |
سنة النشر: | 2023 |
URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::006b89dc32a9b277cf53d110fb93b01b https://doi.org/10.23919/icep58572.2023.10129678 |
حقوق: | CLOSED |
رقم الأكسشن: | edsair.doi...........006b89dc32a9b277cf53d110fb93b01b |
قاعدة البيانات: | OpenAIRE |
الوصف غير متاح. |