Effects of grinding-induced surface topography on the material removal mechanism of silicon chemical mechanical polishing

التفاصيل البيبلوغرافية
العنوان: Effects of grinding-induced surface topography on the material removal mechanism of silicon chemical mechanical polishing
المؤلفون: Hongfei Tao, Qinyang Zeng, Yuanhang Liu, Dewen Zhao, Xinchun Lu
المصدر: Applied Surface Science. 631:157509
بيانات النشر: Elsevier BV, 2023.
سنة النشر: 2023
مصطلحات موضوعية: General Physics and Astronomy, Surfaces and Interfaces, General Chemistry, Condensed Matter Physics, Surfaces, Coatings and Films
تدمد: 0169-4332
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::094e70961cda664f5a81140c57e939d8
https://doi.org/10.1016/j.apsusc.2023.157509
حقوق: CLOSED
رقم الأكسشن: edsair.doi...........094e70961cda664f5a81140c57e939d8
قاعدة البيانات: OpenAIRE