Effect of aluminum trace dimension on electro-migration failure in flip-chip package
| العنوان: | Effect of aluminum trace dimension on electro-migration failure in flip-chip package |
|---|---|
| المؤلفون: | Xiaoyong Miao, Guang-ming Fan, Peisheng Liu, Ya-hong Liu, Longlong Yang |
| المصدر: | International Journal of Modern Physics B. 31:1741002 |
| بيانات النشر: | World Scientific Pub Co Pte Lt, 2017. |
| سنة النشر: | 2017 |
| مصطلحات موضوعية: | Materials science, chemistry.chemical_element, Statistical and Nonlinear Physics, 04 agricultural and veterinary sciences, 02 engineering and technology, 021001 nanoscience & nanotechnology, Condensed Matter Physics, Electromigration, Temperature gradient, chemistry, Dimension (vector space), Aluminium, 040103 agronomy & agriculture, 0401 agriculture, forestry, and fisheries, Coupling (piping), Composite material, 0210 nano-technology, Joule heating, Current density, Flip chip |
| الوصف: | A 3D model of flip-chip package is established and thermal–electrical coupling is analyzed. The effect of the width of Aluminum (Al) trace on electro-migration mechanism is also studied. Reducing rates of the hot-spot temperature, the max Joule heating, the max temperature gradient and the max current density are defined to research the effects of the Al trace thickness and the UBM thickness on electro-migration. |
| تدمد: | 1793-6578 0217-9792 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::0d78beafcb2444e8e265ffc9e468cae3 https://doi.org/10.1142/s0217979217410028 |
| رقم الأكسشن: | edsair.doi...........0d78beafcb2444e8e265ffc9e468cae3 |
| قاعدة البيانات: | OpenAIRE |
| تدمد: | 17936578 02179792 |
|---|